Recently, the charging head network has obtained a 20W super silicon fast charging charger cccjg20cc-x from baseus Beisi. Previously, Beisi has removed the European standard 20W super silicon charger of the same model, but although the model is the same, this one is marked with the word pro on the packaging box, which belongs to the Pro Model.In contrast, this model has rich colors such as black, white, purple, blue and pink, and is equipped with foldable pins, which is easy to carry out. Moreover, the charging head network learned that this charger has built-in tiandeyu fast charging protocol IC jd6606s, which is more compatible with fast charging protocols and more practical. Let's take a look at the detailed disassembly of this charger with Xiaobian.Previously, the charging head network also disassembled Beisi 120W 2c1a gallium nitride fast charging charger, Beisi qc5 certified 100W gallium nitride fast charging, Beisi 100W 2c2a gallium nitride fast charging, Beisi 30W super silicon charger, Beisi 10000mah 1a1c two in one gallium nitride charger and other products. Welcome to consult.As the pro version of super silicon series, Beisi's 20W fast charge adopts purple color, has a high appearance value, and is equipped with folding pins for good portability. Thanks to the application of tiandeyu jd6606s protocol chip, it is compatible with QC, AFC, FCP, SCP and pd3.0 fast charging protocols, supports Apple 20W PD fast charging, and can also meet the fast charging needs of Huawei, Xiaomi and other brands of mobile phones. Moreover, tiandeyu jd6606s has passed the USB PD 3.0 certification. It not only has high performance and high compatibility, but also has reliable chip quality.It is learned from the disassembly of the charging head network that multiple small plates are stacked inside the charger to reduce the overall volume as much as possible. In addition to tiandeyu jd6606s protocol chip, it also adopts the power supply scheme of maorui core mk2687 master control, Huarui micro MOS and mk91738 synchronous rectifier chip. The internal devices are glued and reinforced, and the primary and secondary are insulated and isolated.
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